Features
- LGA1151 socket Intel® Xeon® E3 v5, 7th/6th gen Intel® Core™ i7/i5/i3 & Celeron® processor, up to 80W (codename: Kaby Lake/Skylake)
- Intel® C236 chipset
- Supports 4 expansion slots for full-size add-in cards
- Supports system power on delay function
- -10°C to +70°C operating temperature range
- Supports ECM BIOS setting
- Supports Intel® RAID 0,1,5
- Supports NVIDIA® GPU (up to 300W TDP)
- Supports TPM 2.0
- Supports Intel® AMT 11.0
Introduction
The CEM312 supports Intel® Atom® x5 and x7 processors in a board size of 95 x 95 mm. It has two 204-pin DDR3L-1600 SO-DIMMs with up to 8GB of system memory and an optional eMMC for a maximum of 64GB memory. The COM Express Type 6 module is integrated with Intel® Gen 9 graphics and supported with DX12.0, OCL 2.0 and OGL 4.3 for immersive graphics and media performance with a resolution up to 4K. Moreover, the industrial grade system on module can operate under wide temperature ranging from -40 to 85°C (-40°F to 185°F). The Intel® Atom®-based computer module also offers diverse comprehensive I/O interfaces to meet requirements for a variety of industrial applications. The CEM312 can serve as an excellent solution for graphics-intensive, industrial IoT applications such as industrial control, medical imaging, digital signage, gaming, military, and networking.