Features
- LGA1151 9th/8th gen Intel® Core™ i7/i5/i3 processor
- Intel® H310 chipset (Q370 optional)
- 2 DDR4 SO-DIMM for up to 64GB of memory
- 4 USB 3.0 and 4 USB 2.0 ports
- 2 COM ports
- 2 SATA-600, mSATA and M.2 Key M (NVMe)
- PCIe x4, M.2 Key E, PCI Express Mini Card slot
Introduction
The CEM511, a new COM Express Type 6 Compact form factor module, is powered by the latest 7th generation Intel® Core™ i7/i5/i3 processor (Kabylake-U) for high-performance applications. The palm-sized CEM511 is packed with a variety of rich features including low power consumption, industrial wide temperature range support and impressive graphic processing capability. The COM Express® Type 6 Compact module supports two DDR4-2133 SO-DIMM sockets with a maximum system memory capacity of up to 32GB. It has a rugged design with an extended operating temperature range from -40°C to +85°C (-40°F to +185°F) to satisfy different harsh environment demands. The system on module also delivers outstanding computing, graphics and media performance through its Intel® Gen 9 graphics engine, DirectX 12.0, OCL 2.0, OGL4.3 features and 4K resolution (4096 x 2160 @ 30 Hz) support. Therefore, the power efficient CEM511 is designed for graphics-intensive applications over the Industrial IoT, including industrial control system, medical imaging, digital signage, gaming machines, military, and networking.